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SOLDERING TOOL

 

 
 
*
NO CLEANING HIGH PERFORMANCE RESIN CORE SOLDER
* HIGHEST GRADE FLUX CONSTRUCTION ENABLES LASTING AND RELIABLE BOND


 
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  œ Non-corrosive residue enables no post-soldering cleaning.
œ Allows perfect and lasting bond as its flux residue is neither conductive nor absorbable.
œ Soldering iron dwell time is rapid with activated, speedy surface preparation and wetting.
œ Contains organic, activated resin meets highest JIS grade, MIL-RMA standard
 
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@@@‘RMA Series - For use on precision PCB of copper and its alloy
Model Tin/Lead
Melting Point
Flux
iWt“)
Soluble Resistance
ƒΆE‡p
Insulation Resistance
ƒΆ
Wire Diam.
i‡oj
Wire Length
imj
SWS-06 Sn60/Pb40
183`190Ž
1.7%
Non cleaning FLUX
1~10*5 3~10*13
iNormalj
5~10*12
(High Humdty)
0.6 5.6
SWS-08 0.8 4.4
SWS-10 1.0 5.5
SWS-12 1.2 4.6


  NO CLEANING HIGH PERFORMANCE RESIN CORE SOLDER
EVEN FOR STAINLESS STEEL
 
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  œ Its flux residue is non-corrosive, featuring lasting bond
œ Features quick surface preparation and wetting on stainless steel allowing lasting activation.
œ Contains organic, activated resin, meeting highest JIS standard
 
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@@@‘RA Series - For use on stainless steel and nickel
Model Tin/Lead
Melting Point
Flux
iWt“)
Soluble Resistance
ƒΆE‡p
Insulation Resistance
ƒΆ
Wire Diam.
i‡oj
Wire Length
imj
SWA-06 Sn60/Pb40
183`190Ž
2.7“
Non cleaning FLUX
6~10*4 2~10*13
iNormalj
2~10*12
(High Humdty)
0.6 5.6
SWA-08 0.8 4.4
SWA-10 1.0 5.5
SWA-12 1.2 4.6



Model Wire Dia.
i‡oj
Weight
igj
SWS-56 0.6 500
SWS-58 0.8
SWS-60 1.0
SWS-62 1.2
SWS-76 0.6 1000
SWS-78 0.8
SWS-80 1.0
SWS-82 1.2
@SWS-58 @@@@SWS-80  
 

Model Wire Dia.
i‡oj
Weight
igj
SWA-56 0.6 500
SWA-58 0.8
SWA-60 1.0
SWA-62 1.2
SWA-76 0.6 1000
SWA-78 0.8
SWA-80 1.0
SWA-82 1.2
SWA-58 @@@@SWA-80
 
 

Model Wire Dia.
i‡oj
Weight
igj
SW-11 0.6 150
SW-12 500
SW-13 1000
SW-21 0.8 150
SW-22 500
SW-23 1000
SW-30 1.0 20
SW-31 150
SW-32 500
SW-33 1000
SW-41 1.2 150
SW-42 500
SW-43 1000
SW-51 1.6 150
SW-52 500
SW-53 1000
œ No paste is required due to activated rosin  


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