residue enables no post-soldering cleaning.
Allows perfect and lasting bond as its flux residue
is neither conductive nor absorbable.
Soldering iron dwell time is rapid with activated, speedy
surface preparation and wetting.
Contains organic, activated resin meets highest JIS
grade, MIL-RMA standard
Its flux residue
is non-corrosive, featuring lasting bond
Features quick surface preparation and wetting on stainless
steel allowing lasting activation.
Contains organic, activated resin, meeting highest JIS